W25Q16JWSSIQ - Winbond

W25Q16JWSSIQ Details

• Manufacturer Part Number:

  W25Q16JWSSIQ

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  SOIC-8

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Date Of Intro:

  2019-12-13

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  5.3

• Clock Frequency-Max (fCLK):

  133 MHz

• Data Retention Time-Min:

  20

• Endurance:

  100000 Write/Erase Cycles

• JESD-30 Code:

  S-PDSO-G8

• Length:

  5.23 mm

• Memory Density:

  16777216 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Number of Functions:

  1

• Number of Terminals:

  8

• Number of Words:

  2097152 words

• Number of Words Code:

  2000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  2MX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  SOP

• Package Equivalence Code:

  SOP8,.3

• Package Shape:

  SQUARE

• Package Style:

  SMALL OUTLINE

• Parallel/Serial:

  SERIAL

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Programming Voltage:

  1.8 V

• Seated Height-Max:

  2.16 mm

• Serial Bus Type:

  QSPI

• Standby Current-Max:

  0.000015 A

• Supply Current-Max:

  0.018 mA

• Supply Voltage-Max (Vsup):

  1.95 V

• Supply Voltage-Min (Vsup):

  1.65 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  GULL WING

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Type:

  NOR TYPE

• Width:

  5.23 mm

• Write Protection:

  HARDWARE/SOFTWARE