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W25Q16JWZPJQ - Winbond

Description: New Family of SpiFlash Memories – W25Q16JW: 16M-bit / 2M-byte – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1, – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1)  Highest Performance Serial Flash – 133MHz Quad I/O SPI clocks – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles – More than 20-year data retention  Low Power, Wide Temperature Range – Single 1.65V to 1.95V supply – <0.1µA Power-down (typ.) – -40°C to +85°C operating range

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PCB Footprints
W25Q16JWZPJQ - Winbond PCB footprint - Small Outline No-lead - Small Outline No-lead - 10.1 8-Pad WSON 6x5-mm (Package Code ZP)--
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3D Models
W25Q16JWZPJQ - Winbond  - 3D model - Small Outline No-lead - 10.1 8-Pad WSON 6x5-mm (Package Code ZP)--
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W25Q16JWZPJQ Details

  • Manufacturer Part Number:

    W25Q16JWZPJQ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WSON-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2019-12-13

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    5.3

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    6 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    2097152 words

  • Number of Words Code:

    2000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    1.8 V

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    QSPI

  • Standby Current-Max:

    0.00006 A

  • Supply Current-Max:

    0.018 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    5 mm

  • Write Protection:

    HARDWARE/SOFTWARE

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Manufacturer Collaborated
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W25Q16JWZPJQ Overview

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