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W25Q256JWYIM TR - Winbond

Description: FLASH - NOR Memory IC 256Mb (32M x 8) SPI - Quad I/O, QPI, DTR 133 MHz 6 ns 32-WLCSP (3.98x3.19)

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Symbol

W25Q256JWYIM TR - Winbond - PCB symbol

PCB Footprints

W25Q256JWYIM TR - Winbond PCB footprint - BGA - BGA - 32-Ball WLCSP (Package Code Y, Ball pitch:0.50mm)

3D Models

W25Q256JWYIM TR - Winbond - 3D model - BGA - 32-Ball WLCSP (Package Code Y, Ball pitch:0.50mm)

Datasheet Download Datasheet
Stock & Prices Price & Stock for W25Q256JWYIM TR
Part Number W25Q256JWYIM TR
Manufacturer Winbond
Pin Count 32
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 32-Ball WLCSP (Package Code Y, Ball pitch:0.50mm)
Released Date Sep 9, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

W25Q256JWYIM TR Details

Manufacturer Part Number:
W25Q256JWYIM TR
Manufacturer:
Winbond Electronics Corp

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