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Part Image

W25Q32JVSSIM - Winbond

Description: 32M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI

Download W25Q32JVSSIM Model
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PCB Footprints
W25Q32JVSSIM - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin SOIC 208-mil (Package Code SS)
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3D Models
W25Q32JVSSIM - Winbond  - 3D model - Small Outline Packages - 8-Pin SOIC 208-mil (Package Code SS)
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W25Q32JVSSIM Details

  • Manufacturer Part Number:

    W25Q32JVSSIM

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    5.5

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    5.28 mm

  • Memory Density:

    33554432 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    4194304 words

  • Number of Words Code:

    4000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.3

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    2.16 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.025 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Type:

    NOR TYPE

  • Width:

    5.28 mm

  • Write Protection:

    HARDWARE/SOFTWARE

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

W25Q32JVSSIM Overview

Use the download button to access the W25Q32JVSSIM schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like W25Q3, or try a keyword search, such as Flash Memories

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Part Image EN25QH32B-104HIP2B Elite Semiconductor Memory Technology Inc

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Part Image W25Q32JVSSSQ Winbond Electronics Corp

Flash, 4MX8, PDSO8, SOIC-8

Part Image W25Q32JVSSAQ Winbond Electronics Corp

Flash, 4MX8, PDSO8, SOIC-8

Part Image W25Q32JVSSJM Winbond Electronics Corp

Flash,

Part Image W25Q32JVSSJQTR Winbond Electronics Corp

Flash,

For a full list of alternate parts for W25Q32JVSSIM, check out Findchips.com