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W25Q32JWTCJQ - Winbond

Description:  New Family of SpiFlash Memories – W25Q32JW: 32M-bit / 4M-byte – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1, – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1)  Highest Performance Serial Flash – 133MHz Quad I/O SPI clocks – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles – More than 20-year data retention  Low Power, Wide Temperature Range – Single 1.7V to 1.95V supply – <0.1µA Power-down (typ.) – -40°C to +85/105°C operating ra

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PCB Footprints
W25Q32JWTCJQ - Winbond PCB footprint - BGA - BGA - 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)
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3D Models
W25Q32JWTCJQ - Winbond  - 3D model - BGA - 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)
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W25Q32JWTCJQ Details

  • Manufacturer Part Number:

    W25Q32JWTCJQ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2020-04-06

  • Manufacturer:

    Winbond Electronics Corp

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W25Q32JWTCJQ Overview

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