W25Q64FVSSIG - Winbond

W25Q64FVSSIG Details

• Manufacturer Part Number:

  W25Q64FVSSIG

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  SOIC

• Package Description:

  SOIC-8

• Pin Count:

  8

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  0

• Alternate Memory Width:

  1

• Clock Frequency-Max (fCLK):

  104 MHz

• Data Retention Time-Min:

  20

• JESD-30 Code:

  S-PDSO-G8

• JESD-609 Code:

  e3

• Length:

  5.28 mm

• Memory Density:

  67108864 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  8

• Number of Words:

  8388608 words

• Number of Words Code:

  8000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  8MX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  SOP

• Package Equivalence Code:

  SOP8,.3

• Package Shape:

  SQUARE

• Package Style:

  SMALL OUTLINE

• Parallel/Serial:

  SERIAL

• Peak Reflow Temperature (Cel):

  260

• Programming Voltage:

  3 V

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  2.16 mm

• Serial Bus Type:

  SPI

• Standby Current-Max:

  0.00005 A

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  3 V

• Supply Voltage-Nom (Vsup):

  3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  MATTE TIN

• Terminal Form:

  GULL WING

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  5.28 mm

• Write Protection:

  HARDWARE/SOFTWARE