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Part Image

W25Q64JVSSIQ - Winbond

Description: 64M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI

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PCB Footprints
W25Q64JVSSIQ - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8
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3D Models
W25Q64JVSSIQ - Winbond  - 3D model - Small Outline Packages - SOIC-8
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W25Q64JVSSIQ Details

  • Manufacturer Part Number:

    W25Q64JVSSIQ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    5.6

  • Additional Feature:

    2.7V TO 3V @ 104MHZ

  • Alternate Memory Width:

    1

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5.28 mm

  • Memory Density:

    67108864 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    8388608 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.3

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    2.16 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.018 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Type:

    NOR TYPE

  • Width:

    5.28 mm

  • Write Protection:

    HARDWARE/SOFTWARE

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

W25Q64JVSSIQ Overview

Use the download button to access the W25Q64JVSSIQ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like W25Q6, or try a keyword search, such as Flash Memories

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Part Image W25Q64JVSSIG Winbond Electronics Corp

Flash, 8MX8, PDSO8, SOIC-8

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Flash,

Part Image W25Q64JVSSIMTR Winbond Electronics Corp

Flash, 8MX8, PDSO8, SOIC-8

Part Image W25Q64JVSSJMTR Winbond Electronics Corp

Flash,

Part Image W25Q64JVSTIQ Winbond Electronics Corp

Flash, 64MX1, PDSO8, VSOP-8

For a full list of alternate parts for W25Q64JVSSIQ, check out Findchips.com