W25Q64JVSSIQ - Winbond

W25Q64JVSSIQ Details

• Manufacturer Part Number:

  W25Q64JVSSIQ

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  SOIC-8

• Country Of Origin:

  Taiwan

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  5

• Clock Frequency-Max (fCLK):

  133 MHz

• Data Retention Time-Min:

  20

• Endurance:

  100000 Write/Erase Cycles

• JESD-30 Code:

  R-PDSO-G8

• Length:

  5.28 mm

• Memory Density:

  67108864 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  8

• Number of Words:

  8388608 words

• Number of Words Code:

  8000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  8MX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  SOP

• Package Equivalence Code:

  SOP8,.3

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE

• Parallel/Serial:

  SERIAL

• Peak Reflow Temperature (Cel):

  260

• Programming Voltage:

  3 V

• Seated Height-Max:

  2.16 mm

• Serial Bus Type:

  QSPI

• Standby Current-Max:

  0.000015 A

• Supply Current-Max:

  0.02 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Matte Tin (Sn) - annealed

• Terminal Form:

  GULL WING

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Type:

  NOR TYPE

• Width:

  5.28 mm

• Write Protection:

  HARDWARE/SOFTWARE