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W25Q64JVXGIQ - Winbond

Description: 64M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI

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PCB Footprints
W25Q64JVXGIQ - Winbond PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-Pad XSON 4x4x0.45-mm
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W25Q64JVXGIQ - Winbond  - 3D model - Small Outline No-lead - 8-Pad XSON 4x4x0.45-mm
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W25Q64JVXGIQ Details

  • Manufacturer Part Number:

    W25Q64JVXGIQ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    XSON-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    6

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    4 mm

  • Memory Density:

    67108864 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    8388608 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HXSON

  • Package Equivalence Code:

    SOLCC8,.15,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, EXTREMELY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    0.5 mm

  • Serial Bus Type:

    QSPI

  • Standby Current-Max:

    0.000015 A

  • Supply Current-Max:

    0.02 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    4 mm

  • Write Protection:

    HARDWARE/SOFTWARE

W25Q64JVXGIQ Frequently Asked Questions (FAQs)

  • The W25Q64JVXGIQ has a minimum of 100,000 erase cycles per sector, and a total of 1,000,000 erase cycles for the entire device.
  • The hold pin (HOLD#) should be pulled high during power-up and power-down to prevent the device from entering a state where it may not respond to commands. It's recommended to connect a pull-up resistor to VCC and a capacitor to GND to ensure a clean signal.
  • The W25Q64JVXGIQ supports clock frequencies up to 104 MHz, but it's recommended to use a clock frequency of 50 MHz or lower to ensure reliable operation and minimize power consumption.
  • The WP# pin should be pulled high to enable write protection. When WP# is low, the device is in write-enable mode, and when WP# is high, the device is in write-protect mode. It's recommended to connect a pull-up resistor to VCC to ensure the device is in write-protect mode by default.
  • The Deep Power-Down (DP) mode is a low-power state that reduces the device's power consumption to a minimum. It's intended for use in battery-powered devices or systems that require low power consumption during idle periods. In DP mode, the device's internal voltage regulator is disabled, and the device can only be awakened by a hardware reset or a power cycle.

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W25Q64JVXGIQ Overview

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Part Image W25Q64JVXGJQ Winbond Electronics Corp

Flash, 8MX8, PDSMALL OUTLINE, HEAT SINK/SLUG, EXTREMELY THIN PROFILE8