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W29N02GZSIBA - Winbond

Description: 2Gb SLC NAND Flash MHz TSOPI48

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PCB Footprints
W29N02GZSIBA - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - 13.1 TSOP 48-pin 12x20*-*
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3D Models
W29N02GZSIBA - Winbond  - 3D model - Small Outline Packages - 13.1 TSOP 48-pin 12x20*-*
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W29N02GZSIBA Details

  • Manufacturer Part Number:

    W29N02GZSIBA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOP1-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    6

  • Data Retention Time-Min:

    10

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G48

  • Length:

    18.4 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Programming Voltage:

    1.8 V

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    ONFI 1.0

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.02 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Type:

    SLC NAND TYPE

  • Width:

    12 mm

  • Write Cycle Time-Max (tWC):

    0.000035 ms

  • Write Protection:

    HARDWARE

W29N02GZSIBA Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the W29N02GZSIBA is -40°C to 85°C, but it can also operate in an extended temperature range of -40°C to 105°C with some performance degradation.
  • The HOLD# signal should be asserted low to pause the current read or write operation. When HOLD# is low, the device will tri-state its outputs and ignore any further input signals. To resume the operation, HOLD# should be de-asserted high.
  • The WP# pin is used to protect the entire memory array or specific sectors from unintentional writes. To enable write protection, WP# should be tied low. To disable write protection, WP# should be tied high or left floating.
  • The optimal clock frequency depends on the specific application and system requirements. The W29N02GZSIBA supports clock frequencies up to 133 MHz, but it's recommended to consult the datasheet and perform thorough testing to determine the optimal frequency for your specific use case.
  • The W29N02GZSIBA is a specific part number with a unique combination of features, such as density, package type, and performance characteristics. While other Winbond flash memory chips may share similar features, they may have different densities, packages, or performance characteristics. It's essential to consult the datasheet and compare the features of different parts to determine the best fit for your application.

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W29N02GZSIBA Overview

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