W29N0 Footprint, Symbol and 3D Model search results

Showing 25 of 144 results

Price & Stock Powered by

Filter by Manufacturer

Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W29N08GVSIAD Winbond	1	Flash, 1GX8, PDSO48	Small Outline Packages	W29N08GVSIAD	3D model available Symbol and footprint available 3	1 Download Model
	W29N02KVBIAF Winbond	1	 Basic Features– Density: 2Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature Industrial: -40°C to 85°C Single-Level Cell (SLC) technology Organization– Density: 2G-bit/256M-byte– Page size 2,176 bytes– Block size 64 pages Highest Performance– Read performance (Max.) Random read: 25us Sequential read cycle: 25ns– Write Erase performance Page program time: 250us (typ.) Block erase time: 2ms (typ.)– Endurance: 60,000 Erase/Pr	BGA	W29N02KVBIAF	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVSJAF Winbond	1	4Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N04GVSJAF	3D model available Symbol and footprint available 3	1 Download Model
	W29N08GZBIBF Winbond	1	Basic Features– Density : 8Gbit (2 chip stacked solution)– Vcc : 1.7V to 1.95V– Bus width : x8/x16– Operating temperature Industrial: -40°C to 85°C Industrial Plus: -40°C to 105°C Single-Level Cell (SLC) technology. Organization– Density: 8G-bit/1G-byte– Page size 2,112 bytes (2048 + 64 bytes) 1,056 words (1024 + 32 words)– Block size 64 pages (128K + 4K bytes) 64 pages (64K + 2K words) Highest Performance– Read performance (Max.) Random read: 25us Sequential	BGA	W29N08GZBIBF	3D model available Symbol and footprint available 3	1 Download Model

	W29N02KZBIBF Winbond	1	2Gb SLC NAND Flash MHz VFBGA63	BGA	W29N02KZBIBF	3D model available Symbol and footprint available 3	1 Download Model
	W29N08GZSIBA Winbond	1	Basic Features– Density : 8Gbit (2 chip stacked solution)– Vcc : 1.7V to 1.95V– Bus width : x8/x16– Operating temperature Industrial: -40°C to 85°C Industrial Plus: -40°C to 105°C Single-Level Cell (SLC) technology. Organization– Density: 8G-bit/1G-byte– Page size 2,112 bytes (2048 + 64 bytes) 1,056 words (1024 + 32 words)– Block size 64 pages (128K + 4K bytes) 64 pages (64K + 2K words) Highest Performance– Read performance (Max.) Random read: 25us Sequential	Small Outline Packages	W29N08GZSIBA	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVBINF Winbond	1	1Gb SLC NAND Flash Memory with uniform 2KB+64B page size	BGA	W29N01HVBINF	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVSINF Winbond	1	1Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N01HVSINF	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVDINA Winbond	1	1Gb SLC NAND Flash MHz VFBGA48	BGA	W29N01HVDINA	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVSJNF Winbond	1	1Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N01HVSJNF	3D model available Symbol and footprint available 3	1 Download Model
	W29N08GZSIBF Winbond	1	FLASH - NAND (SLC) Memory IC 8Gbit ONFI 25 ns 48-TSOP	Small Outline Packages	W29N08GZSIBF	3D model available Symbol and footprint available 3	1 Download Model
	W29N08GWSIBA Winbond	1	8G-BIT 1.8V NAND FLASH MEMORY, SOP-48	Small Outline Packages	W29N08GWSIBA	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVSIAF Winbond	1	• Basic Features– Density: 4Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature▪ Industrial: -40°C to 85°C• Single-Level Cell (SLC) technology.• Organization– Density: 4G-bit/512M-byte– Page size▪ 2,112 bytes (2048 + 64 bytes)– Block size▪ 64 pages (128K + 4K bytes)• Highest Performance– Read performance (Max.)▪ Random read: 25us▪ Sequential read cycle: 25ns– Write Erase performance▪ Page program time: 250us(typ.)▪ Block erase time: 2ms(	Small Outline Packages	W29N04GVSIAF	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GZSIBA Winbond	1	4Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N04GZSIBA	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVSINA Winbond	1	1Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N01HVSINA	3D model available Symbol and footprint available 3	1 Download Model

	W29N04GZSJBF Winbond	1	SLC NAND Flash MHz	Small Outline Packages	W29N04GZSJBF	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVBIAA Winbond	1	4Gb SLC NAND Flash MHz VFBGA63	BGA	W29N04GVBIAA	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVBJAF Winbond	1	Basic Features– Density: 4Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature▪ Industrial: -40°C to 85°C• Single-Level Cell (SLC) technology.• Organization– Density: 4G-bit/512M-byte– Page size▪ 2,112 bytes (2048 + 64 bytes)– Block size▪ 64 pages (128K + 4K bytes)• Highest Performance– Read performance (Max.)▪ Random read: 25us▪ Sequential read cycle: 25ns– Write Erase performance▪ Page program time: 250us(typ.)▪ Block erase time: 2ms(ty	BGA	W29N04GVBJAF	3D model available Symbol and footprint available 3	1 Download Model
	W29N02KVSIAF Winbond	1	 Basic Features– Density: 2Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature Industrial: -40°C to 85°C Single-Level Cell (SLC) technology Organization– Density: 2G-bit/256M-byte– Page size 2,176 bytes– Block size 64 pages Highest Performance– Read performance (Max.) Random read: 25us Sequential read cycle: 25ns– Write Erase performance Page program time: 250us (typ.) Block erase time: 2ms (typ.)– Endurance: 60,000 Erase/Pr	Small Outline Packages	W29N02KVSIAF	3D model available Symbol and footprint available 3	1 Download Model
	W29N01GVSIAA Winbond	1	IC FLASH 1GBIT PARALLEL 48TSOP	Small Outline Packages	W29N01GVSIAA	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVBINA Winbond	1	1Gb SLC NAND Flash MHz VFBGA63	BGA	W29N01HVBINA	3D model available Symbol and footprint available 3	1 Download Model
	W29N02KVSIAE Winbond	1	 Basic Features– Density: 2Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature Industrial: -40°C to 85°C Industrial Plus: -40°C to 105°C Single-Level Cell (SLC) technology. Organization– Density: 2G-bit/256M-byte– Page size 2,176 bytes– Block size 64 pages Highest Performance– Read performance (Max.) Random read: 25us Sequential read cycle: 25ns– Write Erase performance Page program time: 250us (typ.) Block erase time: 2ms	Small Outline Packages	W29N02KVSIAE	3D model available Symbol and footprint available 3	1 Download Model
	W29N02GZSIBA Winbond	1	2Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N02GZSIBA	3D model available Symbol and footprint available 3	1 Download Model
	W29N02KVBIAE Winbond	1	2Gb SLC NAND Flash MHz VFBGA63	BGA	W29N02KVBIAE	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVSIAA Winbond	1	• Basic Features– Density: 4Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature▪ Industrial: -40°C to 85°C• Single-Level Cell (SLC) technology• Organization– Density: 4G-bit/512M-byte– Page size▪ 2,112 bytes (2048 + 64 bytes)– Block size▪ 64 pages (128K + 4K bytes)• Highest Performance– Read performance (Max.)▪ Random read: 25us▪ Sequential read cycle: 25ns– Write Erase performance▪ Page program time: 250us(typ.)▪ Block erase time: 2ms(t	Small Outline Packages	W29N04GVSIAA	3D model available Symbol and footprint available 3	1 Download Model
1 2 3 4 5 6

Can't find what you're looking for? Request this part

W29N0 Model Download Search Results

Popular Flash Memories