W29N01HVBINF - Winbond

W29N01HVBINF Details

• Manufacturer Part Number:

  W29N01HVBINF

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  VFBGA-63

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  5

• Command User Interface:

  YES

• Data Polling:

  NO

• Data Retention Time-Min:

  10

• Endurance:

  100000 Write/Erase Cycles

• JESD-30 Code:

  R-PBGA-B63

• Length:

  11 mm

• Memory Density:

  1073741824 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Number of Functions:

  1

• Number of Sectors/Size:

  1K

• Number of Terminals:

  63

• Number of Words:

  134217728 words

• Number of Words Code:

  128000000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  128MX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA63,10X12,32

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Page Size:

  1K words

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Programming Voltage:

  3.3 V

• Ready/Busy:

  YES

• Seated Height-Max:

  1 mm

• Sector Size:

  128K

• Standby Current-Max:

  0.00005 A

• Supply Current-Max:

  0.035 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Toggle Bit:

  YES

• Type:

  SLC NAND TYPE

• Width:

  9 mm

• Write Cycle Time-Max (tWC):

  0.025 ms