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W29N01HZDINA - Winbond

Description: Basic Features – Density: 1Gbit (Single chip solution) – Vcc: 1.7V to 1.95V – Bus width: x8, x16 – Operating temperature  Industrial: -40°C to 85°C  Industrial Plus: -40°C to 105°C  Single-Level Cell (SLC) technology.  Organization – Density: 1G-bit/128M-byte – Page size  2,112 bytes (2048 + 64 bytes)  1,056 words (1024 + 32 words) – Block size  64 pages (128K + 4K bytes)  64 pages (64K + 2K words)  Highest Performance – Read performance (Max.)  Random read: 25us  Sequential re

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PCB Footprints
W29N01HZDINA - Winbond PCB footprint - BGA - BGA - 48 ball VFBGA (x8)*
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W29N01HZDINA - Winbond  - 3D model - BGA - 48 ball VFBGA (x8)*
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W29N01HZDINA Details

  • Manufacturer Part Number:

    W29N01HZDINA

  • Manufacturer:

    Winbond Electronics Corp

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