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W29N01HZDINA - Winbond

Description: Basic Features – Density: 1Gbit (Single chip solution) – Vcc: 1.7V to 1.95V – Bus width: x8, x16 – Operating temperature  Industrial: -40°C to 85°C  Industrial Plus: -40°C to 105°C  Single-Level Cell (SLC) technology.  Organization – Density: 1G-bit/128M-byte – Page size  2,112 bytes (2048 + 64 bytes)  1,056 words (1024 + 32 words) – Block size  64 pages (128K + 4K bytes)  64 pages (64K + 2K words)  Highest Performance – Read performance (Max.)  Random read: 25us  Sequential re

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W29N01HZDINA - Winbond - PCB symbol

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W29N01HZDINA - Winbond PCB footprint - BGA - BGA - 48 ball VFBGA (x8)*

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W29N01HZDINA - Winbond - 3D model - BGA - 48 ball VFBGA (x8)*

Datasheet Download Datasheet
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Part Number W29N01HZDINA
Manufacturer Winbond
Pin Count 48
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 48 ball VFBGA (x8)*
Released Date Jul 22, 2024
Last Modified Date Jul 22, 2024 6:31 AM UTC
Pinout / Pin List Click Here (Member Only)

W29N01HZDINA Details

Manufacturer Part Number:
W29N01HZDINA
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
VFBGA-48
ECCN Code:
EAR99
HTS Code:
8542.32.00.51
Manufacturer:
Winbond Electronics Corp
YTEOL:
5
Command User Interface:
YES
Common Flash Interface:
NO
Data Polling:
NO
Data Retention Time-Min:
10
Endurance:
100000 Write/Erase Cycles
JESD-30 Code:
R-PBGA-B48
Length:
8 mm
Memory Density:
1073741824 bit
Memory IC Type:
FLASH
Memory Width:
8
Number of Functions:
1
Number of Sectors/Size:
1024
Number of Terminals:
48
Number of Words:
134217728 words
Number of Words Code:
128000000
Operating Mode:
ASYNCHRONOUS
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Organization:
128MX8
Package Body Material:
PLASTIC/EPOXY
Package Code:
VFBGA
Package Equivalence Code:
BGA48,6X8,32
Package Shape:
RECTANGULAR
Package Style:
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size:
2K words
Parallel/Serial:
PARALLEL
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Programming Voltage:
1.8 V
Ready/Busy:
YES
Seated Height-Max:
1 mm
Sector Size:
128K
Standby Current-Max:
0.00005 A
Supply Current-Max:
0.035 mA
Supply Voltage-Max (Vsup):
1.95 V
Supply Voltage-Min (Vsup):
1.7 V
Supply Voltage-Nom (Vsup):
1.8 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Form:
BALL
Terminal Pitch:
0.8 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Toggle Bit:
NO
Type:
SLC NAND TYPE
Width:
6.5 mm
Write Cycle Time-Max (tWC):
0.025 ms
Write Protection:
HARDWARE

W29N01HZDINA Frequently Asked Questions (FAQs)

The maximum operating temperature range for the W29N01HZDINA is -40°C to 85°C.
The hold signal (HOLD#) should be asserted low during a write operation to prevent any other device from accessing the memory array.
The write protect (WP#) pin is used to prevent accidental writes to the status register and the memory array. When WP# is low, the status register and memory array are write-protected.
The device density and organization can be determined by reading the device ID and manufacturer ID through the JEDEC ID command (9Fh).
The recommended power-up sequence is to apply VCC first, followed by VPP (if used), and then the clock signal.

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