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W29N02KVSIAE - Winbond

Description:  Basic Features – Density: 2Gbit (Single chip solution) – Vcc: 2.7V to 3.6V – Bus width: x8 – Operating temperature  Industrial: -40°C to 85°C  Industrial Plus: -40°C to 105°C  Single-Level Cell (SLC) technology.  Organization – Density: 2G-bit/256M-byte – Page size  2,176 bytes – Block size  64 pages  Highest Performance – Read performance (Max.)  Random read: 25us  Sequential read cycle: 25ns – Write Erase performance  Page program time: 250us (typ.)  Block erase time: 2ms

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PCB Footprints
W29N02KVSIAE - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - TSOP 48-pin 12x20
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3D Models
W29N02KVSIAE - Winbond  - 3D model - Small Outline Packages - TSOP 48-pin 12x20
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W29N02KVSIAE Details

  • Manufacturer Part Number:

    W29N02KVSIAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOP1-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    6

  • Access Time-Max:

    25 ns

  • Data Retention Time-Min:

    10

  • Endurance:

    60000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G48

  • Length:

    18.4 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    ONFI 1.0

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Type:

    SLC NAND TYPE

  • Width:

    12 mm

  • Write Cycle Time-Max (tWC):

    25 ms

  • Write Protection:

    HARDWARE

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This model has been built in collaboration with the manufacturer.
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W29N02KVSIAE Overview

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