W29N08GZSIBA - Winbond

Description: Basic Features – Density : 8Gbit (2 chip stacked solution) – Vcc : 1.7V to 1.95V – Bus width : x8/x16 – Operating temperature  Industrial: -40°C to 85°C  Industrial Plus: -40°C to 105°C  Single-Level Cell (SLC) technology.  Organization – Density: 8G-bit/1G-byte – Page size  2,112 bytes (2048 + 64 bytes)  1,056 words (1024 + 32 words) – Block size  64 pages (128K + 4K bytes)  64 pages (64K + 2K words)  Highest Performance – Read performance (Max.)  Random read: 25us  Sequential