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W66DP2RQQAGJ - Winbond

Description: Single-Die-Package (SDP) 32Mb x 16DQ x 8-banks x 1 channel with 4 Gb (4,294,967,296 bits) density. Dual-Die-Package (DDP) 32Mb x 16DQ x 8-banks x 2 channels with 8 Gb (8,589,934,592 bits) density

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W66DP2RQQAGJ - Winbond - PCB symbol

PCB Footprints

W66DP2RQQAGJ - Winbond PCB footprint - BGA - BGA - TFBGA 200 Ball (10x14.5 mm2 , Ball pitch: 0.8 x 0.65mm)

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Part Number W66DP2RQQAGJ
Manufacturer Winbond
Pin Count 200
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - TFBGA 200 Ball (10x14.5 mm2 , Ball pitch: 0.8 x 0.65mm)
Released Date Nov 2, 2026
Last Modified Date Nov 2, 2026 8:25 AM UTC
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W66DP2RQQAGJ Details

Manufacturer Part Number:
W66DP2RQQAGJ
Manufacturer:
Winbond Electronics Corp

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