W83627HG-AW - Winbond

W83627HG-AW Details

• Manufacturer Part Number:

  W83627HG-AW

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Transferred

• Part Package Code:

  QFP

• Package Description:

  PLASTIC, QFP-128

• Pin Count:

  128

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.60

• Manufacturer:

  Winbond Electronics Corp

• Address Bus Width:

  4

• Boundary Scan:

  NO

• Bus Compatibility:

  LPC

• Clock Frequency-Max:

  48 MHz

• External Data Bus Width:

  4

• JESD-30 Code:

  R-PQFP-G128

• JESD-609 Code:

  e3

• Length:

  20 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  30

• Number of Terminals:

  128

• Operating Temperature-Max:

  70 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FQFP

• Package Equivalence Code:

  QFP128,.67X.93,20

• Package Shape:

  RECTANGULAR

• Package Style:

  FLATPACK, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (words):

  256

• Seated Height-Max:

  3.32 mm

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  4.5 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Width:

  14 mm