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W955D8MBYA6I - Winbond

Description: DRAM 32Mb HyperRAM x8, 166MHz, Ind temp, 1.8V

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PCB Footprints
W955D8MBYA6I - Winbond PCB footprint - BGA - BGA - TFBGA24 Ball (6x8 mm2 (5x5-1 ball arrays), Ball pitch: 1.00mm, Ø =0.40mm)
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3D Models
W955D8MBYA6I - Winbond  - 3D model - BGA - TFBGA24 Ball (6x8 mm2 (5x5-1 ball arrays), Ball pitch: 1.00mm, Ø =0.40mm)
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W955D8MBYA6I Details

  • Manufacturer Part Number:

    W955D8MBYA6I

  • Manufacturer:

    Winbond Electronics Corp

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