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W971GG8NB-25 - Winbond

Description: 1Gb DDR2 SDRAM 800MHz VFBGA60

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Symbol
W971GG8NB-25 - Winbond - PCB symbol
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PCB Footprints
W971GG8NB-25 - Winbond PCB footprint - BGA - BGA - VFBGA - 60
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3D Models
W971GG8NB-25 - Winbond - 3D model - BGA - VFBGA - 60
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W971GG8NB-25 Details

  • Manufacturer Part Number:

    W971GG8NB-25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-60

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.32

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    4

  • Access Mode:

    MULTI BANK PAGE BURST

  • Clock Frequency-Max (fCLK):

    400 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    4,8

  • JESD-30 Code:

    R-PBGA-B60

  • Length:

    9.5 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    DDR2 DRAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    60

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA60,9X11,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    4,8

  • Standby Current-Max:

    0.008 A

  • Supply Current-Max:

    0.14 mA

  • Supply Voltage-Max (Vsup):

    1.9 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

W971GG8NB-25 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the W971GG8NB-25 is -40°C to 85°C, as specified in the datasheet. However, it's essential to note that the device can tolerate a wider temperature range during storage, typically from -55°C to 125°C.
  • It's crucial to follow a controlled power-up and power-down sequence to prevent damage to the device. The recommended sequence is to power up the VCC supply before the VPP supply, and power down the VPP supply before the VCC supply. Additionally, ensure that the VCC supply is stable and within the recommended voltage range before applying the VPP supply.
  • The maximum allowed voltage on the VPP pin is 12.5V, as specified in the datasheet. Exceeding this voltage can cause permanent damage to the device. It's essential to ensure that the VPP supply is within the recommended voltage range to prevent damage.
  • To implement a reliable write protection mechanism, you can use the WP# pin to control write access to the device. When the WP# pin is low, the device is in write-protect mode, and any write operations will be ignored. You can also use the status register to monitor the write protection status and prevent accidental writes.
  • The recommended method for erasing the entire chip is to use the Chip Erase command (0x60h). This command will erase all data and return the device to its factory default state. Ensure that the device is in the erase mode and the WP# pin is high before issuing the Chip Erase command.

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W971GG8NB-25 Overview

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