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W9825G6KH75L - Winbond

Description: SDRAM 133MHz

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PCB Footprints
W9825G6KH75L - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - Package Outline TSOP (TYPE II) 54L 400 MIL (1:3)-
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3D Models
W9825G6KH75L - Winbond  - 3D model - Small Outline Packages - Package Outline TSOP (TYPE II) 54L 400 MIL (1:3)-
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W9825G6KH75L Details

  • Manufacturer Part Number:

    W9825G6KH75L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.24

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    4

  • Access Mode:

    FOUR BANK PAGE BURST

  • Access Time-Max:

    5.4 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PDSO-G54

  • Length:

    22.22 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    SYNCHRONOUS DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    54

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    16MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP2

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Width:

    10.16 mm

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

W9825G6KH75L Overview

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