The thermal resistance of the WHA5R0FET is not explicitly stated in the datasheet. However, according to Ohmite's application notes, the thermal resistance (RθJA) is typically around 10-15°C/W for this type of device.
While the WHA5R0FET is designed for high-power applications, its frequency response is limited. Ohmite recommends using this device for frequencies up to 100 kHz. For higher frequencies, consider using a different device or consulting with Ohmite's application engineers.
To ensure reliable soldering, follow Ohmite's recommended soldering profile: 260°C peak temperature, 10-15 seconds dwell time, and a soldering iron with a temperature-controlled tip. Additionally, use a solder with a high melting point (e.g., 96.5Sn/3.0Ag/0.5Cu) and a flux that is compatible with the device's terminations.
For optimal thermal performance and to minimize electrical noise, Ohmite recommends a PCB layout with a large copper area (e.g., 1 oz or 2 oz copper) under the device, and a thermal relief pattern around the mounting holes. Consult Ohmite's application notes for more detailed layout guidelines.
The WHA5R0FET is rated for operation up to 150°C. However, for extended reliability, Ohmite recommends derating the device's power dissipation at higher temperatures. Consult the datasheet and Ohmite's application notes for more information on thermal derating.
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