The thermal resistance of the WLBR005FET is typically around 2.5°C/W, but it's recommended to consult with Ohmite's application engineers for specific thermal design considerations.
While the WLBR005FET is designed for high-power applications, it's not optimized for high-frequency use. Ohmite recommends using their FETs up to 100 kHz, but for higher frequencies, it's best to consult with their application engineers or consider alternative products.
To ensure reliable soldering, follow Ohmite's recommended soldering profile, which includes a peak temperature of 260°C (500°F) for 10-15 seconds. Additionally, use a solder with a melting point above 180°C (356°F) and avoid applying excessive force or vibration during the soldering process.
For optimal thermal performance and to minimize electrical noise, Ohmite recommends a PCB layout with a large copper area for heat dissipation, a solid ground plane, and short, direct traces for the FET's source, drain, and gate connections. Consult Ohmite's application notes for more detailed guidance.
The WLBR005FET is rated for operation up to 150°C (302°F), but Ohmite recommends derating the power dissipation at higher temperatures to ensure reliable operation. Consult Ohmite's application engineers for specific guidance on high-temperature applications.
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