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WNA25RFET - Ohmite

Description: Ohmite WN Series ceramic Axial Wirewound Resistor 25Ω 1% 0.5W ±20ppm/°C

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WNA25RFET - Ohmite  - 3D model
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WNA25RFET Details

  • Manufacturer Part Number:

    WNA25RFET

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    AXIAL LEADED

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.80

  • Manufacturer:

    Ohmite Mfg Co

  • YTEOL:

    10

  • Additional Feature:

    NON-INDUCTIVE

  • Construction:

    Tubular

  • JESD-609 Code:

    e3

  • Lead Diameter:

    0.6 mm

  • Lead Length:

    25 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Diameter:

    2.54 mm

  • Package Length:

    5.08 mm

  • Package Shape:

    TUBULAR PACKAGE

  • Package Style:

    Axial

  • Packing Method:

    TR, 11.41 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Resistance:

    25 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Surface Mount:

    NO

  • Technology:

    WIRE WOUND

  • Temperature Coefficient:

    20 ppm/°C

  • Terminal Finish:

    Tin (Sn)

  • Terminal Shape:

    WIRE

  • Tolerance:

    1%

  • Working Voltage:

    3.5355 V

WNA25RFET Frequently Asked Questions (FAQs)

  • The thermal resistance of the WNA25RFET is typically around 1.5°C/W (junction-to-case) and 5°C/W (junction-to-ambient) at a maximum operating temperature of 150°C.
  • Yes, the WNA25RFET is suitable for high-frequency applications up to 1 GHz due to its low capacitance and inductance. However, it's essential to consider the device's parasitic elements and layout to minimize signal degradation.
  • To ensure reliability, follow proper thermal management practices, such as using a heat sink, ensuring good airflow, and keeping the device within its specified operating temperature range. Additionally, consider derating the device's power handling to account for potential thermal and electrical stresses.
  • A recommended PCB layout for the WNA25RFET includes using a thermal pad, keeping the device away from high-impedance nodes, and minimizing the length of the drain and source connections. A 4-layer PCB with a solid ground plane is also recommended to reduce electromagnetic interference (EMI).
  • Yes, the WNA25RFET can be used in switching applications due to its low gate charge and fast switching times. However, it's essential to consider the device's gate-source voltage, drain-source voltage, and current handling to ensure reliable operation.

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WNA25RFET Overview

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