- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for WPN252012H1R0MT
- Part Number WPN252012H1R0MT
- Manufacturer SUNLORD
- Pin Count 2
- Part Category Inductor
- Package Category Other
- Footprint Name Other - WPN252012H1R0MT-1
- Released Date Apr 26, 2022
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
WPN252012H1R0MT Details
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Manufacturer Part Number:
WPN252012H1R0MT
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Manufacturer:
Sunlord
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YTEOL:
7.8
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Case/Size Code:
1008
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Construction:
Rectangular
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Core Material:
Ferrite
WPN252012H1R0MT Frequently Asked Questions (FAQs)
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The recommended land pattern for WPN252012H1R0MT is a rectangular pad with a size of 2.5mm x 1.2mm, with a solder mask opening of 2.2mm x 1.0mm.
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To handle thermal management, ensure good airflow around the component, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and consider using a heat sink or thermal pad.
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The maximum operating temperature range for WPN252012H1R0MT is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
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To ensure reliability in high-vibration environments, use a secure mounting method, such as soldering or adhesive bonding, and consider using a vibration-dampening material or potting compound.
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The recommended reflow soldering profile for WPN252012H1R0MT is a peak temperature of 260°C, with a ramp-up rate of 3°C/s, a dwell time of 30-60 seconds, and a cool-down rate of 6°C/s.
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WPN252012H1R0MT Overview
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