A thermal pad on the bottom of the module should be connected to a large copper area on the PCB, and multiple vias should be used to dissipate heat to the other side of the board.
Ensure good airflow, use a heat sink if possible, and consider derating the output power according to the temperature derating curve in the datasheet.
A low-ESR ceramic capacitor (e.g., X7R or X5R) with a value of 10-22uF is recommended, depending on the input voltage and ripple requirements.
Yes, but ensure that the modules are synchronized and that the output voltages are matched to prevent current circulation. Consult the datasheet and application notes for more information.
The maximum cable length depends on the specific application and noise environment. As a general rule, keep cable lengths as short as possible (<10cm) to minimize EMI and voltage drops.
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