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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for WSL0805R0600FEB
- Part Number WSL0805R0600FEB
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
WSL0805R0600FEB Details
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Manufacturer Part Number:
WSL0805R0600FEB
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Israel, USA
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
6 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
11
WSL0805R0600FEB Frequently Asked Questions (FAQs)
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The recommended land pattern for WSL0805R0600FEB is a rectangular pad with a size of 0.8 mm x 1.2 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
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While WSL0805R0600FEB has a high operating temperature range of -55°C to +155°C, it's essential to consider the derating curve and power rating to ensure the component doesn't exceed its maximum power dissipation. Consult the datasheet and application notes for more information.
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WSL0805R0600FEB is a moisture-sensitive device (MSD). To prevent damage, store the components in a dry environment (less than 30% RH) and follow the recommended baking and handling procedures outlined in the datasheet and IPC/JEDEC standards.
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The recommended soldering profile for WSL0805R0600FEB is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. Consult the datasheet and application notes for more information.
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While WSL0805R0600FEB is a robust component, it's essential to consider the mechanical stress and vibration requirements of your application. Consult the datasheet and application notes for more information on the component's mechanical characteristics and recommended mounting techniques.
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WSL0805R0600FEB Overview
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