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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for WSLP0805R0270FEA
- Part Number WSLP0805R0270FEA
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
WSLP0805R0270FEA Details
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Manufacturer Part Number:
WSLP0805R0270FEA
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Israel, USA
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
6 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
11
WSLP0805R0270FEA Frequently Asked Questions (FAQs)
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The recommended land pattern for WSLP0805R0270FEA is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
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WSLP0805R0270FEA has a maximum operating temperature of 150°C. While it can tolerate high temperatures, it's essential to ensure that the component is not exposed to temperatures above 150°C for an extended period to prevent degradation or failure.
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To prevent damage, handle WSLP0805R0270FEA by the edges, avoid touching the component's surface, and use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD).
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The recommended soldering profile for WSLP0805R0270FEA is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. This ensures proper soldering and minimizes the risk of component damage.
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WSLP0805R0270FEA has a moisture sensitivity level (MSL) of 1, which means it can tolerate normal humidity levels. However, it's essential to follow proper storage and handling procedures to prevent moisture absorption.
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WSLP0805R0270FEA Overview
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