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XA2C256-8VQG100Q - AMD

Description: CPLD - Complex Programmable Logic Devices XA2C256-8VQG100Q

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XA2C256-8VQG100Q - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - VQG100
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XA2C256-8VQG100Q - AMD  - 3D model - Quad Flat Packages - VQG100
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XA2C256-8VQG100Q Details

  • Manufacturer Part Number:

    XA2C256-8VQG100Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VQFP-100

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Additional Feature:

    REAL DIGITAL DESIGN TECHNOLOGY

  • Clock Frequency-Max:

    130 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    80

  • Number of Inputs:

    80

  • Number of Macro Cells:

    256

  • Number of Outputs:

    80

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    0 DEDICATED INPUTS, 80 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    7.5 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

XA2C256-8VQG100Q Frequently Asked Questions (FAQs)

  • The XA2C256-8VQG100Q has a maximum operating temperature range of -40°C to 100°C (industrial grade) and 0°C to 85°C (commercial grade).
  • AMD recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The datasheet provides a reference design for this purpose.
  • AMD recommends using a single, high-quality clock source, such as a crystal oscillator or a phase-locked loop (PLL), to drive the FPGA's clock inputs. The datasheet provides guidelines for clock signal integrity and jitter tolerance.
  • To optimize power consumption, use the AMD-provided power estimation tools, such as the Power Estimator spreadsheet, to estimate power consumption based on your design. Additionally, implement power-saving techniques, such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • The XA2C256-8VQG100Q has 256 Kbits of internal memory, which can be used for configuration, data storage, or as a cache. However, the internal memory has limited access bandwidth and may not be suitable for high-bandwidth applications. External memory interfaces, such as DDR3 or DDR4, can be used to supplement the internal memory.

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XA2C256-8VQG100Q Overview

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