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XA6SLX9-2CSG225Q - AMD

Description: Automotive, AEC-Q100, Spartan®-6 LX XA Field Programmable Gate Array (FPGA) IC 160 589824 9152 225-LFBGA, CSPBGA

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PCB Footprints
XA6SLX9-2CSG225Q - AMD PCB footprint - BGA - BGA - CSG225
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3D Models
XA6SLX9-2CSG225Q - AMD  - 3D model - BGA - CSG225
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XA6SLX9-2CSG225Q Details

  • Manufacturer Part Number:

    XA6SLX9-2CSG225Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    7.3

  • Clock Frequency-Max:

    62.5 MHz

  • Combinatorial Delay of a CLB-Max:

    0.26 ns

  • JESD-30 Code:

    S-PBGA-B225

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    160

  • Number of Logic Cells:

    9152

  • Number of Outputs:

    160

  • Number of Terminals:

    225

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    715 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA225,15X15,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    45 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

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XA6SLX9-2CSG225Q Overview

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