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XC2287M104F80LRABKXUMA1 - Infineon

Description: 16-bit Microcontrollers - MCU 16 BIT FLASH C11 BCS

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XC2287M104F80LRABKXUMA1 - Infineon PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP-144-
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XC2287M104F80LRABKXUMA1 Details

  • Manufacturer Part Number:

    XC2287M104F80LRABKXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    0.0197 INCH PITCH, GREEN, PLASTIC, LQFP-144

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    36 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    116

  • Number of Terminals:

    144

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    32768

  • ROM (words):

    851968

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    80 MHz

  • Supply Voltage-Max:

    1.6 V

  • Supply Voltage-Min:

    1.4 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

XC2287M104F80LRABKXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design guide for PCB layout and thermal management. It's recommended to follow the guidelines for optimal performance and reliability. Additionally, consider using thermal interface materials and heat sinks to reduce thermal resistance.
  • Follow Infineon's guidelines for EMC and EMI reduction, such as using shielding, filtering, and proper grounding. Also, consider using simulation tools to analyze and optimize your design for EMC and EMI.
  • Infineon provides guidelines for soldering and assembly in their application notes. It's recommended to follow the guidelines for reflow soldering, and consider using a nitrogen atmosphere to reduce oxidation.
  • Use Infineon's debugging tools and software, such as the XC2287M104F80LRABKXUMA1 evaluation board and the DAVE development environment. Also, consider using oscilloscopes and logic analyzers to debug and troubleshoot issues.
  • Infineon provides reliability data and qualification reports for the XC2287M104F80LRABKXUMA1. It's recommended to review these reports and consider the component's operating conditions, storage, and handling to ensure long-term reliability and durability.

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XC2287M104F80LRABKXUMA1 Overview

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