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XC2S30-5VQG100C - AMD

Description: IC FPGA 60 I/O 100VQFP

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PCB Footprints
XC2S30-5VQG100C - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - VQG100
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XC2S30-5VQG100C - AMD  - 3D model - Quad Flat Packages - VQG100
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XC2S30-5VQG100C Details

  • Manufacturer Part Number:

    XC2S30-5VQG100C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VQFP-100

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Additional Feature:

    MAXIMUM USABLE GATES 30000

  • Clock Frequency-Max:

    263 MHz

  • Combinatorial Delay of a CLB-Max:

    0.7 ns

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    216

  • Number of Equivalent Gates:

    30000

  • Number of Inputs:

    64

  • Number of Logic Cells:

    972

  • Number of Outputs:

    60

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Organization:

    216 CLBS, 30000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    2.625 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    150 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

XC2S30-5VQG100C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC2S30-5VQG100C is -40°C to 100°C.
  • To implement a CDC in XC2S30-5VQG100C, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated.
  • The maximum frequency achievable with XC2S30-5VQG100C depends on the design complexity and the clocking architecture. However, the maximum clock frequency is typically around 200-250 MHz.
  • To optimize power consumption in XC2S30-5VQG100C, use power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Also, optimize the design to reduce switching activity and use low-power modes when possible.
  • Yes, XC2S30-5VQG100C is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its radiation-hardened design and error correction capabilities.

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XC2S30-5VQG100C Overview

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Image Part Number Model
Part Image XC2S30-5VQ100C AMD Xilinx

Field Programmable Gate Array, 216 CLBs, 30000 Gates, 263MHz, 972-Cell, PQFP100

Part Image XC2S30-5VQG100I AMD Xilinx

Field Programmable Gate Array, 216 CLBs, 30000 Gates, 263MHz, 972-Cell, PQFP100

Part Image XC2S30-5VQG100I AMD

Field Programmable Gate Array, 216 CLBs, 30000 Gates, 263MHz, 972-Cell, PQFP100

Part Image XC2S30-5VQ100I AMD

Field Programmable Gate Array, 216 CLBs, 30000 Gates, 263MHz, 972-Cell, PQFP100

Part Image XC2S30-5VQ100C AMD

Field Programmable Gate Array, 216 CLBs, 30000 Gates, 263MHz, 972-Cell, PQFP100

For a full list of alternate parts for XC2S30-5VQG100C, check out Findchips.com