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XC3S250E-4TQ144I - AMD

Description: FPGA - Field Programmable Gate Array XC3S250E-4TQ144I

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XC3S250E-4TQ144I - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - TQFP (TQ144/TQG144)
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XC3S250E-4TQ144I - AMD  - 3D model - Quad Flat Packages - TQFP (TQ144/TQG144)
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XC3S250E-4TQ144I Details

  • Manufacturer Part Number:

    XC3S250E-4TQ144I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TQFP-144

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    572 MHz

  • Combinatorial Delay of a CLB-Max:

    0.76 ns

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    612

  • Number of Equivalent Gates:

    250000

  • Number of Inputs:

    108

  • Number of Logic Cells:

    5508

  • Number of Outputs:

    80

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    612 CLBS, 250000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

XC3S250E-4TQ144I Frequently Asked Questions (FAQs)

  • The XC3S250E-4TQ144I has an industrial temperature range of -40°C to 100°C, making it suitable for use in harsh environments.
  • Xilinx provides guidelines and tools for implementing CDCs in their FPGAs. You can use the Xilinx Clocking Wizard to generate a CDC module, or implement a custom CDC using synchronizers or FIFOs.
  • The power consumption of the XC3S250E-4TQ144I depends on the design and operating conditions. You can estimate power consumption using Xilinx's Power Estimator (XPE) tool, which provides a detailed breakdown of power consumption based on your design.
  • Yes, the XC3S250E-4TQ144I has dedicated transceivers for high-speed serial interfaces like PCIe and SATA. However, you'll need to ensure that your design meets the specific requirements for these interfaces, such as signal integrity and jitter tolerance.
  • Xilinx provides various security features, such as bitstream encryption and authentication, to protect your design. You can also use third-party IP protection tools and techniques, like obfuscation and watermarking, to secure your IP.

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XC3S250E-4TQ144I Overview

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XC3S250E-4TQ144I Alternates

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Image Part Number Model
Part Image XC3S250E-4TQG144C AMD Xilinx

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PQFP144

Part Image XC3S250E-4TQ144C AMD Xilinx

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PQFP144

Part Image XC3S250E-4TQ144I AMD Xilinx

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PQFP144

Part Image XC3S250E-4TQG144C AMD

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PQFP144

Part Image XC3S250E-4TQG144CS1 AMD Xilinx

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PQFP144

For a full list of alternate parts for XC3S250E-4TQ144I, check out Findchips.com