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XC3S400-4TQ144C - AMD

Description: FPGA - Field Programmable Gate Array 400000 SYSTEM GATE 1.2 VOLT FPGA

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XC3S400-4TQ144C - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - TQFP (TQ144/TQG144)
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XC3S400-4TQ144C - AMD  - 3D model - Quad Flat Packages - TQFP (TQ144/TQG144)
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XC3S400-4TQ144C Details

  • Manufacturer Part Number:

    XC3S400-4TQ144C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    22 X 22 MM, TQFP-144

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    630 MHz

  • Combinatorial Delay of a CLB-Max:

    0.61 ns

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    896

  • Number of Equivalent Gates:

    400000

  • Number of Inputs:

    97

  • Number of Logic Cells:

    8064

  • Number of Outputs:

    97

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Organization:

    896 CLBS, 400000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

XC3S400-4TQ144C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC3S400-4TQ144C is 350 MHz, but it depends on the specific application and design implementation.
  • To implement a CDC in the XC3S400-4TQ144C, you can use synchronous or asynchronous CDC techniques, such as using FIFOs, gray counters, or handshake signals. Xilinx provides guidelines and IP cores to help with CDC implementation.
  • The power consumption of the XC3S400-4TQ144C depends on the specific design, operating frequency, and voltage. However, Xilinx provides power estimation tools and guidelines to help estimate power consumption. Typically, the power consumption is around 1-2 Watts for a typical design.
  • To optimize the XC3S400-4TQ144C for low power consumption, you can use techniques such as clock gating, power gating, voltage scaling, and reducing switching activity. Xilinx provides power optimization tools and guidelines to help with this process.
  • The XC3S400-4TQ144C has 192 KB of block RAM and 576 KB of distributed RAM. However, the actual amount of memory available depends on the specific design and implementation.

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XC3S400-4TQ144C Overview

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Part Image XC3S400-4TQG144I AMD Xilinx

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PQFP144

Part Image XC3S400-4TQG144C AMD Xilinx

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PQFP144

Part Image XC3S400-4TQ144C AMD Xilinx

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PQFP144

Part Image XC3S400-4TQG144I AMD

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PQFP144