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XC3S50A-4FTG256I - AMD

Description: XILINX - XC3S50A-4FTG256I - FPGA, SPARTAN-3A, 50K, 256FTBGA

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XC3S50A-4FTG256I - AMD PCB footprint - BGA - BGA - 256 ball fine -pitch thin bga
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XC3S50A-4FTG256I - AMD  - 3D model - BGA - 256 ball fine -pitch thin bga
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XC3S50A-4FTG256I Details

  • Manufacturer Part Number:

    XC3S50A-4FTG256I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FTBGA-256

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.71 ns

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    176

  • Number of Equivalent Gates:

    50000

  • Number of Inputs:

    144

  • Number of Logic Cells:

    1584

  • Number of Outputs:

    112

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    176 CLBS, 50000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

XC3S50A-4FTG256I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC3S50A-4FTG256I is -40°C to 100°C (industrial grade) and -40°C to 85°C (commercial grade).
  • Xilinx provides a Clock Domain Crossing (CDC) user guide that explains how to implement CDC in their FPGAs, including the XC3S50A. It involves using synchronizers, FIFOs, and other techniques to ensure reliable data transfer between clock domains.
  • The power consumption of XC3S50A-4FTG256I depends on the operating frequency, voltage, and usage. According to the datasheet, the typical power consumption is around 1.2W at 50MHz, but it can vary depending on the specific application.
  • While the XC3S50A-4FTG256I has high-speed transceivers, it is not suitable for high-speed serial interfaces like PCIe or SATA due to its limited bandwidth and lack of dedicated PHYs. Xilinx recommends using their higher-end FPGAs, such as the Virtex or Kintex series, for such applications.
  • Xilinx provides a range of debugging and testing tools, including ChipScope, SignalTap, and the Vivado Design Suite, which allow you to debug and test your design on the XC3S50A-4FTG256I. You can also use third-party tools and methodologies, such as simulation and verification frameworks.

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XC3S50A-4FTG256I Overview

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Image Part Number Model
Part Image XC3S50A-4FTG256C AMD Xilinx

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 667MHz, 1584-Cell, CMOS, PBGA256

Part Image XC3S50A-4FT256I AMD Xilinx

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 667MHz, 1584-Cell, CMOS, PBGA256

Part Image XC3S50A-4FT256C AMD

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 667MHz, 1584-Cell, CMOS, PBGA256

Part Image XC3S50A-4FTG256C AMD

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 667MHz, 1584-Cell, CMOS, PBGA256

Part Image XC3S50A-4FT256I AMD

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 667MHz, 1584-Cell, CMOS, PBGA256

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