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XC4VSX35-11FF668I - AMD

Description: IC FPGA 448 I/O 668FCBGA

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XC4VSX35-11FF668I - AMD - PCB symbol
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XC4VSX35-11FF668I - AMD PCB footprint - BGA - BGA - FF668 Flip-Chip Fine-Pitch BGA Package Specifications (1.00 mm pitch)
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XC4VSX35-11FF668I - AMD - 3D model - BGA - FF668 Flip-Chip Fine-Pitch BGA Package Specifications (1.00 mm pitch)
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XC4VSX35-11FF668I Details

  • Manufacturer Part Number:

    XC4VSX35-11FF668I

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-668

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    1205 MHz

  • Combinatorial Delay of a CLB-Max:

    0.17 ns

  • JESD-30 Code:

    S-PBGA-B668

  • JESD-609 Code:

    e0

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    3840

  • Number of Inputs:

    448

  • Number of Logic Cells:

    34560

  • Number of Outputs:

    448

  • Number of Terminals:

    668

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    3840 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA668,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.85 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XC4VSX35-11FF668I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC4VSX35-11FF668I is 350 MHz, but it can vary depending on the specific application and design.
  • You can implement a DDR2 memory interface using the FPGA's Memory Interface Generator (MIG) tool, which provides a pre-designed and verified interface. You'll need to follow the MIG user guide and Xilinx's DDR2 interface specification.
  • The power consumption of the XC4VSX35-11FF668I depends on the specific design, operating frequency, and voltage. However, according to the datasheet, the typical static power consumption is around 1.2W, and the dynamic power consumption can range from 2.5W to 12W depending on the design.
  • Yes, the XC4VSX35-11FF668I is capable of supporting high-speed serial interfaces like PCIe and SATA. However, you'll need to use the FPGA's high-speed transceivers and follow Xilinx's guidelines for implementing these interfaces.
  • You can use Xilinx's ChipScope Pro tool for debugging and testing your design. This tool allows you to insert logic analyzer cores into your design, capture and analyze signals, and perform other debugging tasks.

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XC4VSX35-11FF668I Overview

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XC4VSX35-11FF668I Alternates

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Image Part Number Model
Part Image XC4VSX35-11FFG668I AMD Xilinx

Field Programmable Gate Array, 3840 CLBs, 1205MHz, 34560-Cell, CMOS, PBGA668
Part Image XC4VSX35-11FF668C AMD

Field Programmable Gate Array, 3840 CLBs, 1205MHz, 34560-Cell, CMOS, PBGA668
Part Image XC4VSX35-11FFG668C AMD

Field Programmable Gate Array, 3840 CLBs, 1205MHz, 34560-Cell, CMOS, PBGA668
Part Image XC4VSX35-11FFG668I AMD

Field Programmable Gate Array, 3840 CLBs, 1205MHz, 34560-Cell, CMOS, PBGA668
Part Image XC4VSX35-11FF668C AMD Xilinx

Field Programmable Gate Array, 3840 CLBs, 1205MHz, 34560-Cell, CMOS, PBGA668
For a full list of alternate parts for XC4VSX35-11FF668I, check out Findchips.com