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XC6SLX100-2CSG484I - AMD

Description: FPGA - Field Programmable Gate Array XC6SLX100-2CSG484I

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XC6SLX100-2CSG484I - AMD PCB footprint - BGA - BGA - CSG484 - Wire-Bond Chip-Scale BGA (0.8 mm Pitch)
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XC6SLX100-2CSG484I - AMD  - 3D model - BGA - CSG484 - Wire-Bond Chip-Scale BGA (0.8 mm Pitch)
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XC6SLX100-2CSG484I Details

  • Manufacturer Part Number:

    XC6SLX100-2CSG484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.26 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    7911

  • Number of Inputs:

    320

  • Number of Logic Cells:

    101261

  • Number of Outputs:

    320

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    7911 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.8 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

XC6SLX100-2CSG484I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX100-2CSG484I is 350 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power consumption using techniques like pipelining and parallel processing.
  • The -2 speed grade has a maximum clock frequency of 350 MHz, while the -3 speed grade has a maximum clock frequency of 400 MHz. The -3 speed grade is faster and more expensive than the -2 speed grade.
  • Yes, the XC6SLX100-2CSG484I is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its ruggedized design, error correction capabilities, and compliance with various industry standards.
  • To ensure signal integrity, use the Xilinx ISE Design Suite to analyze and optimize your design for signal integrity, follow best practices for PCB design and layout, and use signal integrity analysis tools like IBIS and HSPICE.

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XC6SLX100-2CSG484I Overview

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Part Image XC6SLX100-2CSG484C AMD

Field Programmable Gate Array, 7911 CLBs, 667MHz, 101261-Cell, CMOS, PBGA484

Part Image XC6SLX100-2CS484C AMD

Field Programmable Gate Array, 7911 CLBs, 667MHz, 101261-Cell, CMOS, PBGA484