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XC6SLX100-2FGG484C - AMD

Description: XILINX - XC6SLX100-2FGG484C - FPGA, SPARTAN-6 LX, 101K, 484FGGBGA

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XC6SLX100-2FGG484C - AMD PCB footprint - BGA - BGA - FG(G) 484
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XC6SLX100-2FGG484C - AMD  - 3D model - BGA - FG(G) 484
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XC6SLX100-2FGG484C Details

  • Manufacturer Part Number:

    XC6SLX100-2FGG484C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.26 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    7911

  • Number of Inputs:

    326

  • Number of Logic Cells:

    101261

  • Number of Outputs:

    326

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    7911 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XC6SLX100-2FGG484C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX100-2FGG484C is 350 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power using techniques like pipelining and parallel processing.
  • The XC6SLX100-2FGG484C has 37,440 logic cells, 11,440 slices, 4,800 Kbits of block RAM, and 240 DSP slices. The maximum amount of memory available depends on the specific configuration and usage of these resources.
  • Yes, the XC6SLX100-2FGG484C supports high-speed serial interfaces like PCIe Gen1/2 and SATA II, but it may require additional IP cores and specific design considerations to achieve the required speeds and signal integrity.
  • To ensure signal integrity and reduce noise, follow Xilinx's guidelines for PCB design, use proper signal routing and termination, and implement noise reduction techniques like shielding, filtering, and decoupling.

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XC6SLX100-2FGG484C Overview

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Part Image XC6SLX100-2FGG484I AMD

Field Programmable Gate Array, 7911 CLBs, 667MHz, 101261-Cell, CMOS, PBGA484

Part Image XC6SLX100-2FGG484I AMD Xilinx

Field Programmable Gate Array, 7911 CLBs, 667MHz, 101261-Cell, CMOS, PBGA484