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XC6SLX100-3FGG676I - AMD

Description: Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 480 4939776 101261 676-BGA

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XC6SLX100-3FGG676I - AMD PCB footprint - BGA - BGA - FG676/FGG676
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XC6SLX100-3FGG676I - AMD  - 3D model - BGA - FG676/FGG676
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XC6SLX100-3FGG676I Details

  • Manufacturer Part Number:

    XC6SLX100-3FGG676I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    862 MHz

  • Combinatorial Delay of a CLB-Max:

    0.21 ns

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    7911

  • Number of Inputs:

    480

  • Number of Logic Cells:

    101261

  • Number of Outputs:

    480

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    7911 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XC6SLX100-3FGG676I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX100-3FGG676I is 350 MHz.
  • You can implement a DDR3 memory interface on the XC6SLX100-3FGG676I using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates a customized DDR3 memory controller IP core that can be integrated into your design.
  • Yes, the XC6SLX100-3FGG676I is suitable for high-reliability applications. It is fabricated using a 45nm process and has a number of features that make it suitable for high-reliability applications, including built-in SEU (Single Event Upset) detection and correction, and support for triple modular redundancy (TMR).
  • To optimize power consumption on the XC6SLX100-3FGG676I, you can use a number of techniques, including clock gating, voltage scaling, and dynamic voltage and frequency scaling. You can also use the Xilinx Power Analyzer tool to estimate and optimize power consumption in your design.
  • Yes, the XC6SLX100-3FGG676I is suitable for cryptographic applications. It has a number of features that make it suitable for cryptographic applications, including built-in support for cryptographic algorithms such as AES and SHA, and a secure boot mechanism to prevent unauthorized access to the device.

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XC6SLX100-3FGG676I Overview

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Image Part Number Model
Part Image XC6SLX100-3FGG676C AMD Xilinx

Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA676

Part Image XC6SLX100-3FGG676C AMD

Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA676

Part Image XC6SLX100-3FG676I AMD

Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA676

Part Image XC6SLX100-3FG676I AMD Xilinx

Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA676

Part Image XC6SLX100-3FG676Q AMD

Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, PBGA676

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