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XC6SLX150-2FG484I - AMD

Description: FPGA - Field Programmable Gate Array XC6SLX150-2FG484I

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XC6SLX150-2FG484I - AMD PCB footprint - BGA - BGA - FG484
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XC6SLX150-2FG484I - AMD  - 3D model - BGA - FG484
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XC6SLX150-2FG484I Details

  • Manufacturer Part Number:

    XC6SLX150-2FG484I

  • Part Life Cycle Code:

    Active

  • Package Description:

    23 X 23 MM, 1 MM PITCH, FBGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.26 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e0

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    11519

  • Number of Inputs:

    338

  • Number of Logic Cells:

    147443

  • Number of Outputs:

    338

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    11519 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XC6SLX150-2FG484I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX150-2FG484I is 350 MHz, but it depends on the specific application and design implementation.
  • The XC6SLX150-2FG484I has a built-in DDR3 memory controller, which can be implemented using the Xilinx Memory Interface Generator (MIG) tool. The MIG tool provides a wizard-based interface to generate the necessary IP cores and constraints for the DDR3 interface.
  • The power consumption of the XC6SLX150-2FG484I depends on the specific application, clock frequency, and operating conditions. However, according to the Xilinx datasheet, the typical power consumption is around 1.2W for a typical design.
  • Yes, the XC6SLX150-2FG484I has built-in high-speed serial transceivers that support PCIe, SATA, and other high-speed serial interfaces. However, the specific implementation and performance may vary depending on the design and application.
  • Xilinx provides a range of debugging and testing tools, including ChipScope, SignalTap, and the Vivado Design Suite. These tools allow you to debug and test your design at various stages of development, from simulation to hardware implementation.

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XC6SLX150-2FG484I Overview

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Image Part Number Model
Part Image XC6SLX150-2FGG484I AMD Xilinx

Field Programmable Gate Array, 11519 CLBs, 667MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150-2FG484C AMD

Field Programmable Gate Array, 11519 CLBs, 667MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150-2FG484C AMD Xilinx

Field Programmable Gate Array, 11519 CLBs, 667MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150-2FGG484C AMD Xilinx

Field Programmable Gate Array, 11519 CLBs, 667MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150-2FG484I AMD Xilinx

Field Programmable Gate Array, 11519 CLBs, 667MHz, 147443-Cell, CMOS, PBGA484

For a full list of alternate parts for XC6SLX150-2FG484I, check out Findchips.com