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XC6SLX150-L1FGG484I - AMD

Description: FPGA - Field Programmable Gate Array XC6SLX150-L1FGG484I

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XC6SLX150-L1FGG484I - AMD PCB footprint - BGA - BGA - FGG484_2021_3
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XC6SLX150-L1FGG484I - AMD  - 3D model - BGA - FGG484_2021_3
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XC6SLX150-L1FGG484I Details

  • Manufacturer Part Number:

    XC6SLX150-L1FGG484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    500 MHz

  • Combinatorial Delay of a CLB-Max:

    0.46 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    11519

  • Number of Inputs:

    338

  • Number of Logic Cells:

    147443

  • Number of Outputs:

    338

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    11519 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XC6SLX150-L1FGG484I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX150-L1FGG484I is 350 MHz, but it depends on the specific application and design implementation.
  • You can implement a DDR3 memory interface using the Memory Interface Generator (MIG) tool in Vivado Design Suite, which provides a pre-built IP core for DDR3 memory interfaces.
  • The power consumption of the XC6SLX150-L1FGG484I depends on the specific design and usage. However, the typical static power consumption is around 1.2W, and the dynamic power consumption can range from 2W to 10W or more, depending on the clock frequency and activity.
  • Yes, the XC6SLX150-L1FGG484I has built-in transceivers that support high-speed serial interfaces like PCIe, SATA, and others. However, the specific implementation and performance will depend on the design and requirements.
  • You can use the Vivado Design Suite and its built-in debugging tools, such as the Vivado Logic Analyzer and the Vivado Serial I/O Analyzer, to debug and test your design. Additionally, you can use external debugging tools and equipment, such as oscilloscopes and logic analyzers.

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XC6SLX150-L1FGG484I Overview

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Image Part Number Model
Part Image XC6SLX150-L1FG484I AMD

Field Programmable Gate Array, 11519 CLBs, 500MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150-L1FGG484C AMD

Field Programmable Gate Array, 11519 CLBs, 500MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150-L1FG484C AMD

Field Programmable Gate Array, 11519 CLBs, 500MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150-L1FGG484I AMD Xilinx

Field Programmable Gate Array, 11519 CLBs, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150-L1FG484I AMD Xilinx

Field Programmable Gate Array, 11519 CLBs, 147443-Cell, CMOS, PBGA484

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