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XC6SLX150T-3CSG484I - AMD

Description: FPGA - Field Programmable Gate Array XC6SLX150T-3CSG484I

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XC6SLX150T-3CSG484I - AMD PCB footprint - BGA - BGA - CSG484 - Wire-Bond Chip-Scale BGA (0.8 mm Pitch)
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XC6SLX150T-3CSG484I - AMD  - 3D model - BGA - CSG484 - Wire-Bond Chip-Scale BGA (0.8 mm Pitch)
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XC6SLX150T-3CSG484I Details

  • Manufacturer Part Number:

    XC6SLX150T-3CSG484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    862 MHz

  • Combinatorial Delay of a CLB-Max:

    0.21 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    11519

  • Number of Inputs:

    296

  • Number of Logic Cells:

    147443

  • Number of Outputs:

    296

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    11519 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.8 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

XC6SLX150T-3CSG484I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX150T-3CSG484I is 350 MHz, but it depends on the specific application and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power consumption.
  • The -3 speed grade has a higher maximum operating frequency (350 MHz) compared to the -2 speed grade (275 MHz), but the -2 speed grade has lower power consumption.
  • No, the XC6SLX150T-3CSG484I is not designed for high-reliability or radiation-hardened applications. For such applications, consider using Xilinx's QPro or RT Pro devices.
  • Use the Xilinx ISE Design Suite to analyze and optimize signal integrity, and follow best practices for PCB design, such as using differential pairs, adding decoupling capacitors, and minimizing signal routing.

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XC6SLX150T-3CSG484I Overview

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Image Part Number Model
Part Image XC6SLX150T-3CSG484C AMD

Field Programmable Gate Array, 11519 CLBs, 862MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150T-3CS484C AMD

Field Programmable Gate Array, 11519 CLBs, 862MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150T-3CSG484I AMD Xilinx

Field Programmable Gate Array, 11519 CLBs, 862MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150T-3CS484C AMD Xilinx

Field Programmable Gate Array, 862MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150T-3CS484I AMD Xilinx

Field Programmable Gate Array, 862MHz, 147443-Cell, CMOS, PBGA484

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