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XC6SLX150T-3FGG484C - AMD

Description: FPGA - Field Programmable Gate Array XC6SLX150T-3FGG484C

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XC6SLX150T-3FGG484C - AMD PCB footprint - BGA - BGA - FGG484_
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XC6SLX150T-3FGG484C - AMD  - 3D model - BGA - FGG484_
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XC6SLX150T-3FGG484C Details

  • Manufacturer Part Number:

    XC6SLX150T-3FGG484C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    862 MHz

  • Combinatorial Delay of a CLB-Max:

    0.21 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    11519

  • Number of Inputs:

    296

  • Number of Logic Cells:

    147443

  • Number of Outputs:

    296

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    11519 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XC6SLX150T-3FGG484C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX150T-3FGG484C is 550 MHz, but it depends on the specific application and design implementation.
  • The XC6SLX150T-3FGG484C has a built-in DDR3 memory controller, and you can use the Xilinx MIG (Memory Interface Generator) tool to generate the necessary IP core and implement the DDR3 interface.
  • The power consumption of the XC6SLX150T-3FGG484C depends on the specific application, clock frequency, and design implementation. However, the typical power consumption is around 2-3 Watts, and the maximum power consumption is around 6 Watts.
  • Yes, the XC6SLX150T-3FGG484C has built-in high-speed serial transceivers that support PCIe, SATA, and other high-speed serial interfaces up to 6.25 Gbps.
  • You can program and configure the XC6SLX150T-3FGG484C using the Xilinx ISE Design Suite or Vivado Design Suite, which provide a comprehensive development environment for designing, implementing, and testing FPGA-based systems.

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XC6SLX150T-3FGG484C Overview

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Image Part Number Model
Part Image XC6SLX150T-3FG484I AMD

Field Programmable Gate Array, 11519 CLBs, 862MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150T-3FG484I AMD Xilinx

Field Programmable Gate Array, 11519 CLBs, 862MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150T-3FG484Q AMD Xilinx

Field Programmable Gate Array

Part Image XC6SLX150T-3FGG484C AMD Xilinx

Field Programmable Gate Array, 11519 CLBs, 862MHz, 147443-Cell, CMOS, PBGA484

Part Image XC6SLX150T-3FGG484Q AMD

Field Programmable Gate Array, 11519 CLBs, 862MHz, 147443-Cell, PBGA484

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