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XC6SLX25-2FT256C - AMD

Description: FPGA - Field Programmable Gate Array XC6SLX25-2FT256C

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XC6SLX25-2FT256C - AMD PCB footprint - BGA - BGA - FT(G)256
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XC6SLX25-2FT256C - AMD  - 3D model - BGA - FT(G)256
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XC6SLX25-2FT256C Details

  • Manufacturer Part Number:

    XC6SLX25-2FT256C

  • Part Life Cycle Code:

    Active

  • Package Description:

    17 X 17 MM, 1 MM PITCH, FBGA-256

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.26 ns

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1879

  • Number of Inputs:

    186

  • Number of Logic Cells:

    24051

  • Number of Outputs:

    186

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1879 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

XC6SLX25-2FT256C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX25-2FT256C is dependent on the specific design and implementation, but Xilinx recommends a maximum clock frequency of 350 MHz for most applications.
  • The XC6SLX25-2FT256C has a built-in DDR3 memory controller, and Xilinx provides a DDR3 memory interface IP core that can be used to implement a DDR3 memory interface. The IP core is available in the Xilinx Vivado Design Suite.
  • The power consumption of the XC6SLX25-2FT256C depends on the specific design and implementation, as well as the operating frequency and voltage. Xilinx provides power estimation tools, such as XPower Analyzer, to help estimate power consumption.
  • Yes, the XC6SLX25-2FT256C is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems. Xilinx provides a range of features and tools to support high-reliability design, including built-in error correction and detection mechanisms.
  • Xilinx provides a range of security features and tools to help secure designs on the XC6SLX25-2FT256C, including bitstream encryption, secure boot, and anti-tamper features. Additionally, Xilinx recommends using secure design practices, such as encrypting sensitive data and using secure communication protocols.

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XC6SLX25-2FT256C Overview

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Part Image XC6SLX25-2FTG256C AMD

Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA256

Part Image XC6SLX25-2FTG256I AMD Xilinx

Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA256

Part Image XC6SLX25-2FTG256I AMD

Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA256

Part Image XC6SLX25-2FT256I AMD

Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA256

Part Image XC6SLX25-2FT256I AMD Xilinx

Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA256

For a full list of alternate parts for XC6SLX25-2FT256C, check out Findchips.com