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XC6SLX9-L1TQG144C - AMD

Description: FPGA - Field Programmable Gate Array XC6SLX9-L1TQG144C

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XC6SLX9-L1TQG144C - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - TQFP (TQ144/TQG144)
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XC6SLX9-L1TQG144C - AMD  - 3D model - Quad Flat Packages - TQFP (TQ144/TQG144)
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XC6SLX9-L1TQG144C Details

  • Manufacturer Part Number:

    XC6SLX9-L1TQG144C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    20 X 20 MM, 0.50 MM PITCH, LEAD FREE, TQFP-144

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    500 MHz

  • Combinatorial Delay of a CLB-Max:

    0.46 ns

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    715

  • Number of Inputs:

    102

  • Number of Logic Cells:

    9152

  • Number of Outputs:

    102

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Organization:

    715 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

XC6SLX9-L1TQG144C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX9-L1TQG144C is 350 MHz, but it depends on the specific application and design implementation.
  • You can implement DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx, which generates a customized IP core for the FPGA.
  • The power consumption of the XC6SLX9-L1TQG144C depends on the specific design implementation, but the typical static power consumption is around 1.2W, and the dynamic power consumption can range from 2W to 10W or more, depending on the clock frequency and activity.
  • Yes, the XC6SLX9-L1TQG144C has built-in transceivers that support high-speed serial interfaces like PCIe, SATA, and others, with data rates up to 6.25 Gbps.
  • You can use Xilinx's ChipScope Pro tool, which provides a set of debug and verification tools, including logic analyzers, protocol analyzers, and debug cores, to help you debug and verify your design.

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XC6SLX9-L1TQG144C Overview

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Part Image XC6SLX9-L1TQG144I AMD

Field Programmable Gate Array, 715 CLBs, 500MHz, 9152-Cell, CMOS, PQFP144

Part Image XC6SLX9-L1TQG144I AMD Xilinx

Field Programmable Gate Array, 715 CLBs, 9152-Cell, CMOS, PQFP144