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XC6VHX380T-1FFG1924C - AMD

Description: IC FPGA 640 I/O 1924FCBGA

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XC6VHX380T-1FFG1924C - AMD PCB footprint - BGA - BGA - 1924FCBGA
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XC6VHX380T-1FFG1924C - AMD  - 3D model - BGA - 1924FCBGA
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XC6VHX380T-1FFG1924C Details

  • Manufacturer Part Number:

    XC6VHX380T-1FFG1924C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    45 X 45 MM, LEAD FREE, FBGA-1924

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    7

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    0.36 ns

  • JESD-30 Code:

    S-PBGA-B1924

  • JESD-609 Code:

    e1

  • Length:

    45 mm

  • Moisture Sensitivity Level:

    4

  • Number of Inputs:

    640

  • Number of Logic Cells:

    382464

  • Number of Outputs:

    640

  • Number of Terminals:

    1924

  • Operating Temperature-Max:

    85 °C

  • Organization:

    29880 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1924,44X44,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.85 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    45 mm

XC6VHX380T-1FFG1924C Frequently Asked Questions (FAQs)

  • The XC6VHX380T-1FFG1924C has an industrial temperature range of -40°C to 100°C, and a commercial temperature range of 0°C to 85°C.
  • Xilinx recommends using an external POR circuit with a voltage supervisor IC, such as the Xilinx Power Management Controller (PMC) or a third-party device like the Texas Instruments TPS3808. The FPGA's internal POR circuit can also be used, but it may not be as reliable as an external implementation.
  • Xilinx provides detailed PCB layout guidelines in the 'Virtex-6 FPGA PCB Design and Pin Planning Guide' (UG419). Key considerations include signal integrity, power distribution, and thermal management.
  • Use Xilinx's Power Estimator (XPE) tool to estimate power consumption based on your design's specific requirements. Optimize power consumption by using power-saving features like clock gating, dynamic voltage and frequency scaling, and low-power modes.
  • The XC6VHX380T-1FFG1924C has 378,880 logic cells, 444,000 bits of block RAM, and 1,280 Kbits of distributed RAM. If your design requires more memory, consider using external memory devices like DDR3, DDR4, or QDR II+ SRAM.

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XC6VHX380T-1FFG1924C Overview

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Image Part Number Model
Part Image XC6VHX380T-1FFG1924C AMD Xilinx

Field Programmable Gate Array, 1098MHz, 382464-Cell, CMOS, PBGA1924

Part Image XC6VHX380T-1FFG1924I AMD Xilinx

Field Programmable Gate Array, 1098MHz, 382464-Cell, CMOS, PBGA1924

Part Image XC6VHX380T-1FF1924C AMD Xilinx

Field Programmable Gate Array, 1098MHz, 382464-Cell, CMOS, PBGA1924

Part Image XC6VHX380T-1FF1924I AMD

Field Programmable Gate Array, 29880 CLBS, 1098MHz, 382464-Cell, CMOS, PBGA1924

Part Image XC6VHX380T-1FF1924C AMD

Field Programmable Gate Array, 29880 CLBS, 1098MHz, 382464-Cell, CMOS, PBGA1924

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