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XC6VSX475T-1FFG1156I - AMD

Description: Virtex®-6 SXT Field Programmable Gate Array (FPGA) IC 600 39223296 476160 1156-BBGA, FCBGA

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XC6VSX475T-1FFG1156I - AMD PCB footprint - BGA - BGA - 1156 Ball Flip-Chip BGA
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XC6VSX475T-1FFG1156I - AMD  - 3D model - BGA - 1156 Ball Flip-Chip BGA
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XC6VSX475T-1FFG1156I Details

  • Manufacturer Part Number:

    XC6VSX475T-1FFG1156I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    35 X 35 MM, LEAD FREE, FBGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    8

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    5.08 ns

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of Inputs:

    600

  • Number of Logic Cells:

    476160

  • Number of Outputs:

    600

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    37200 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC6VSX475T-1FFG1156I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6VSX475T-1FFG1156I FPGA is dependent on the specific design and implementation. However, Xilinx provides a maximum clock frequency of 450 MHz for the Virtex-6 family, which this device belongs to.
  • To optimize power consumption, use Xilinx's Power Estimator (XPE) tool to estimate power consumption early in the design cycle. Implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS). Additionally, use the FPGA's built-in power management features, such as the Power Management Controller (PMC).
  • Use Xilinx's Memory Interface Generator (MIG) tool to generate a DDR3 memory interface. MIG provides a pre-verified, optimized IP core that can be easily integrated into your design. Additionally, follow Xilinx's guidelines for DDR3 memory interface implementation, including signal integrity and timing closure considerations.
  • Use Xilinx's Signal Integrity (SI) analysis tools, such as the Signal Integrity Wizard, to analyze and optimize signal integrity in your design. Implement best practices for signal routing, such as using differential pairs, minimizing signal length, and using signal shielding. Additionally, use the FPGA's built-in signal conditioning features, such as the Input/Output Block (IOB) and the Output Buffer (OBUF).
  • The XC6VSX475T-1FFG1156I FPGA has a maximum junction temperature (TJ) of 100°C. Ensure proper thermal management by using a heat sink, thermal interface material, and a well-designed PCB thermal layout. Monitor the FPGA's temperature using the on-chip temperature sensor and adjust the system's thermal design accordingly.

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XC6VSX475T-1FFG1156I Overview

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Field Programmable Gate Array, 37200 CLBs, 1098MHz, 476160-Cell, CMOS, PBGA1156

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Part Image XC6VSX475T-1FF1156I AMD Xilinx

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Part Image XC6VSX475T-1FF1156C AMD Xilinx

Field Programmable Gate Array, 1098MHz, 476160-Cell, CMOS, PBGA1156