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XC7A100T-1FGG484I - AMD

Description: XILINX - XC7A100T-1FGG484I - FPGA, Artix-7, MMCM, PLL, 285 I/O's, 464 MHz, 101440 Cells, 950 mV to 1.05 V, FPBGA-484

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PCB Footprints
XC7A100T-1FGG484I - AMD PCB footprint - BGA - BGA - FGGA484 (Spartan-7 FPGAs) Wire-Bond Fine-Pitch BGA (1.0 mm Pitch)_1
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3D Models
XC7A100T-1FGG484I - AMD  - 3D model - BGA - FGGA484 (Spartan-7 FPGAs) Wire-Bond Fine-Pitch BGA (1.0 mm Pitch)_1
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XC7A100T-1FGG484I Details

  • Manufacturer Part Number:

    XC7A100T-1FGG484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    7925

  • Number of Inputs:

    285

  • Number of Logic Cells:

    101440

  • Number of Outputs:

    285

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    7925 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XC7A100T-1FGG484I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A100T is 350 MHz.
  • You can implement DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates a customized IP core for the DDR3 interface.
  • The power consumption of XC7A100T depends on the operating frequency, voltage, and other factors. The typical power consumption is around 1.5W to 2.5W. However, it's recommended to use the Xilinx Power Estimator (XPE) tool to get an accurate estimate of power consumption for your specific design.
  • Yes, the XC7A100T is suitable for high-reliability applications. It has a number of features that make it suitable for such applications, including built-in error correction, single-event upset (SEU) mitigation, and a high level of radiation tolerance.
  • To optimize timing closure for XC7A100T, use the Vivado Design Suite's built-in tools, such as the Timing Closure Flow, and follow best practices such as pipelining, retiming, and clock domain crossing.

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XC7A100T-1FGG484I Overview

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Part Image XC7A100T-1FGG484I AMD Xilinx

Field Programmable Gate Array, 7925 CLBs, 1098MHz, 101440-Cell, CMOS, PBGA484

Part Image XC7A100T-1FGG484C AMD

Field Programmable Gate Array, 7925 CLBs, 1098MHz, 101440-Cell, CMOS, PBGA484

Part Image XC7A100T-1FG484I AMD Xilinx

Field Programmable Gate Array, 7925 CLBs, 101440-Cell, CMOS, PBGA484

Part Image XC7A100T-1FGG484C AMD Xilinx

Field Programmable Gate Array, 7925 CLBs, 1098MHz, 101440-Cell, CMOS, PBGA484