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XC7A100T-1FGG676I - AMD

Description: XILINX - XC7A100T-1FGG676I - FPGA, Artix-7, MMCM, PLL, 300 I/O's, 464 MHz, 101440 Cells, 950 mV to 1.05 V, FCBGA-676

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PCB Footprints
XC7A100T-1FGG676I - AMD PCB footprint - BGA - BGA - FGGA676
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XC7A100T-1FGG676I - AMD  - 3D model - BGA - FGGA676
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XC7A100T-1FGG676I Details

  • Manufacturer Part Number:

    XC7A100T-1FGG676I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-676

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    7925

  • Number of Inputs:

    300

  • Number of Logic Cells:

    101440

  • Number of Outputs:

    300

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    7925 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XC7A100T-1FGG676I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A100T-1FGG676I is 350 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequency, use low-power modes, and optimize the design for low power consumption.
  • The -1 speed grade has a maximum clock frequency of 350 MHz, while the -2 speed grade has a maximum clock frequency of 450 MHz. The -2 speed grade is faster but also consumes more power.
  • The XC7A100T-1FGG676I has an industrial temperature range of -40°C to 100°C, but it's recommended to operate within the commercial temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, use the Xilinx ISE Design Suite or Vivado Design Suite to analyze and optimize signal integrity, and follow best practices for PCB design, routing, and termination.

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XC7A100T-1FGG676I Overview

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