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XC7A100T-1FTG256I - AMD

Description: FPGA - Field Programmable Gate Array XC7A100T-1FTG256I

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XC7A100T-1FTG256I - AMD PCB footprint - BGA - BGA - XC7A100T-1FTG256I
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XC7A100T-1FTG256I - AMD  - 3D model - BGA - XC7A100T-1FTG256I
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XC7A100T-1FTG256I Details

  • Manufacturer Part Number:

    XC7A100T-1FTG256I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-256

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    7925

  • Number of Inputs:

    170

  • Number of Logic Cells:

    101440

  • Number of Outputs:

    170

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    7925 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

XC7A100T-1FTG256I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A100T-1FTG256I is 350 MHz, but it depends on the specific application and design implementation.
  • You can implement a DDR3 memory interface using the FPGA's Memory Interface Generator (MIG) tool, which provides a pre-designed and verified IP core for DDR3 memory interfaces.
  • The power consumption of the XC7A100T-1FTG256I depends on the specific design and operating conditions. However, according to the datasheet, the typical static power consumption is around 1.2W, and the dynamic power consumption can range from 1.5W to 3.5W depending on the clock frequency and activity.
  • Yes, the XC7A100T-1FTG256I has built-in transceivers that support high-speed serial interfaces like PCIe, SATA, and others. However, the specific implementation and performance will depend on the design and the target application.
  • You can use Xilinx's Vivado Design Suite, which provides a comprehensive development environment for designing, testing, and debugging FPGA-based systems. Additionally, you can use various debugging tools like ChipScope, SignalTap, and Logic Analyzer to debug and test your design.

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XC7A100T-1FTG256I Overview

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