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XC7A100T-2FGG484C - AMD

Description: IC FPGA 285 I/O 484FCBGA

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XC7A100T-2FGG484C - AMD PCB footprint - BGA - BGA - 484 BGA
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XC7A100T-2FGG484C - AMD  - 3D model - BGA - 484 BGA
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XC7A100T-2FGG484C Details

  • Manufacturer Part Number:

    XC7A100T-2FGG484C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA, BGA484,22X22,40

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    7925

  • Number of Inputs:

    285

  • Number of Logic Cells:

    101440

  • Number of Outputs:

    285

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    7925 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XC7A100T-2FGG484C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of XC7A100T-2FGG484C is 500 MHz.
  • You can implement DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates a customized IP core for DDR3 memory interface.
  • The power consumption of XC7A100T-2FGG484C depends on the operating frequency, voltage, and other factors. According to the datasheet, the typical power consumption is around 1.5W at 500 MHz.
  • Yes, XC7A100T-2FGG484C is suitable for high-reliability applications. It has a high MTBF (Mean Time Between Failures) and is designed to meet the requirements of aerospace, defense, and other high-reliability industries.
  • You can secure your design on XC7A100T-2FGG484C using Xilinx's Secure Boot and Encryption features. These features provide a secure way to boot and configure the FPGA, and encrypt the bitstream to prevent unauthorized access.

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XC7A100T-2FGG484C Overview

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Image Part Number Model
Part Image XC7A100T-2FGG484I AMD

Field Programmable Gate Array, 7925 CLBs, 1286MHz, 101440-Cell, CMOS, PBGA484

Part Image XC7A100T-2FGG484C AMD Xilinx

Field Programmable Gate Array, 7925 CLBs, 1286MHz, 101440-Cell, CMOS, PBGA484