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XC7A200T-1FBG676C - AMD

Description: FPGA - Field Programmable Gate Array XC7A200T-1FBG676C

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XC7A200T-1FBG676C - AMD PCB footprint - BGA - BGA - FBG676
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XC7A200T-1FBG676C - AMD  - 3D model - BGA - FBG676
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XC7A200T-1FBG676C Details

  • Manufacturer Part Number:

    XC7A200T-1FBG676C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-676

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    16825

  • Number of Inputs:

    400

  • Number of Logic Cells:

    215360

  • Number of Outputs:

    400

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    85 °C

  • Organization:

    16825 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.54 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XC7A200T-1FBG676C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A200T-1FBG676C is 500 MHz, but it depends on the specific application and design implementation.
  • You can implement DDR3 memory interface using the Memory Interface Generator (MIG) tool in Vivado Design Suite, which provides a wizard-based interface to generate the necessary IP cores and constraints.
  • The power consumption of the XC7A200T-1FBG676C depends on the specific design implementation, clock frequency, and operating conditions. However, the typical static power consumption is around 2.5W, and the dynamic power consumption can range from 5W to 15W or more, depending on the design.
  • Yes, the XC7A200T-1FBG676C is capable of supporting high-speed serial interfaces like PCIe and SATA, but it requires careful design and implementation to meet the specific protocol requirements and signal integrity constraints.
  • To optimize the XC7A200T-1FBG676C for low power consumption, you can use various techniques such as clock gating, power gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS), as well as optimizing the design for minimal resource utilization and clock frequency.

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XC7A200T-1FBG676C Overview

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Part Image XC7A200T-1FBG676I AMD

Field Programmable Gate Array, 16825 CLBs, 1098MHz, 215360-Cell, CMOS, PBGA676

Part Image XC7A200T-1FBG676I AMD Xilinx

Field Programmable Gate Array, 16825 CLBs, 1098MHz, 215360-Cell, CMOS, PBGA676

Part Image XC7A200T-1FBV676C AMD Xilinx

Field Programmable Gate Array, 16825 CLBs, PBGA676